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John Ternus emerges as Apple’s next leader to take over from Tim Cook

Updated April 20, 2026, 8:04 p.m. ET
John Ternus, senior vice president of hardware engineering at Apple Inc., during an Apple event in New York, US, on Wednesday, March 4, 2026. Apple announced on April 20, 2026 that CEO Tim Cook would step down in September, handing the chief executive job to company veteran John Ternus.
John Ternus, senior vice president of hardware engineering at Apple Inc., during an Apple event in New York, US, on Wednesday, March 4, 2026. Apple announced on April 20, 2026 that CEO Tim Cook would step down in September, handing the chief executive job to company veteran John Ternus.
Bloomberg Via Getty Images
Apple Vice President, Hardware Engineering John Ternus speaks on stage at San Jose McEnery Convention Center during Apple's World Wide Developers Conference in San Jose, California on June 5, 2017.
Apple Vice President, Hardware Engineering John Ternus speaks on stage at San Jose McEnery Convention Center during Apple's World Wide Developers Conference in San Jose, California on June 5, 2017.
JOSH EDELSON, AFP Via Getty Images
This handout released and taken on Nov. 10, 2020 by Apple inc. shows Apple's vice president of Hardware Engineering John Ternus unveiling M1, the first chip designed specifically for the Mac during a special event at Apple Park in Cupertino, Calif.
This handout released and taken on Nov. 10, 2020 by Apple inc. shows Apple's vice president of Hardware Engineering John Ternus unveiling M1, the first chip designed specifically for the Mac during a special event at Apple Park in Cupertino, Calif.
Apple Inc./AFP Via Getty Images
Apple's John Ternus speaks during the 2017 Apple Worldwide Developer Conference (WWDC) at the San Jose Convention Center on June 5, 2017 in San Jose, Calif.
Apple's John Ternus speaks during the 2017 Apple Worldwide Developer Conference (WWDC) at the San Jose Convention Center on June 5, 2017 in San Jose, Calif.
Justin Sullivan, Getty Images
John Ternus, VP Hardware Engineering speaks at Apple event at the Brooklyn Academy of Music in Brooklyn, New York on Oct. 30, 2018.
John Ternus, VP Hardware Engineering speaks at Apple event at the Brooklyn Academy of Music in Brooklyn, New York on Oct. 30, 2018.
Robert Deutsch, USA TODAY
Apple's vice president of Hardware Engineering John Ternus speaks during Apple's Worldwide Developer Conference (WWDC) in San Jose, Calif. on June 3, 2019.
Apple's vice president of Hardware Engineering John Ternus speaks during Apple's Worldwide Developer Conference (WWDC) in San Jose, Calif. on June 3, 2019.
BRITTANY HOSEA-SMALL, AFP Via Getty Images
John Ternus, senior vice president of hardware engineering at Apple Inc., speaks about iMac computers during the Peek Performance virtual event in New York, U.S., on Tuesday, March 8, 2022.
John Ternus, senior vice president of hardware engineering at Apple Inc., speaks about iMac computers during the Peek Performance virtual event in New York, U.S., on Tuesday, March 8, 2022.
Bloomberg Via Getty Images
John Ternus, Vice President, Mac and iPad Hardware Engineering speaks during Apple's annual world wide developer conference (WWDC) in San Jose, Calif. on June 5, 2017.
John Ternus, Vice President, Mac and iPad Hardware Engineering speaks during Apple's annual world wide developer conference (WWDC) in San Jose, Calif. on June 5, 2017.
Stephen Lam, REUTERS
John Ternus, Apple VP of Hardware Engineering, speaks about the new Mac Pro during Apple's annual Worldwide Developers Conference in San Jose, Calif. on June 3, 2019.
John Ternus, Apple VP of Hardware Engineering, speaks about the new Mac Pro during Apple's annual Worldwide Developers Conference in San Jose, Calif. on June 3, 2019.
MASON TRINCA, REUTERS
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